IEEE Computer Society Annual Symposium on VLSI,
Pittsburgh, Pennsylvania, U.S.A., July 11-13, 2016

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 Keynote 1: 9:00am ~ 9:45am, Monday, July 11, 2016

“Putting the Star in EDA, E*A”

Sani R. Nassif

CEO, Radyalis LLC

 

Abstract:

No fields in Engineering have had the sustained exponential that was Moore’s Law. One of the outcomes is a rich culture of “using computers to automate the design of computers”, namely EDA, which has had to rapidly adapt to ever larger complexity. But with Moore’s era now over, it is time to apply the energy of the EDA community to other areas. This talk will explore the application of EDA techniques and knowhow to the area of Cancer Radiation Therapy.

 

Short Bio:

Sani received his Bachelors degree with Honors from the American University of Beirut in 1980, and his Masters and PhD degrees from Carnegie-Mellon University in 1981 and 1986 respectively. He then worked for ten years at Bell Laboratories in the general area of technology CAD, focusing on various aspects of design and technology coupling including device modeling, parameter extraction, worst case analysis, design optimization and circuit simulation. While at Bell Labs, working under Larry Nagel -the original author of Spice, he led a large team in the development of an in-house circuit simulator, named Celerity, which became the main circuit simulation tool at Bell Labs.

In January 1996, he joined the then newly formed IBM Austin Research Laboratory (ARL), which was founded with a specific focus on research for the support of IBM's Power computer systems. After twelve years of management, he stepped down to focus on technical work again with an emphasis on applying techniques developed in the VLSI-EDA area to IBM's Smarter Planet initiative.

In January 2014 Sani founded Radyalis, a company focused on applying VLSI-EDA techniques to the field of Cancer Radiation Therapy. In October 2015, Radyalis announced that it has closed a deal with LSI software to license its flagship Monte Carlo particle therapy simulator.

Sani has authored one book, many book chapters, and numerous conference and journal publications. He has delivered many tutorials at top conferences and has received Best Paper awards from TCAD, ICCAD, DAC, ISQED, ICCD and SEMICON, authored invited papers to ISSCC, IEDM, IRPS, ISLPED, HOTCHIPS, and CICC. He has given Keynote and Plenary presentations at Sasimi, ESSCIRC, BMAS, SISPAD, SEMICON, VLSI-SOC, PATMOS, NMI, ASAP, GLVLSI, TAU, and ISVLSI. He is an IEEE Fellow, was a member of the IBM Academy of Technology, a member of the ACM and the AAAS, and an IBM master inventor with more than 75 patents.

Dr. Nassif was the president of the IEEE Council on EDA (CEDA) for 2014 and 2015, was the General chair of the ICCAD conference in 2008, and has served on the technical program committees of ICCAD, DAC and other conferences. He received the Penrose award (given to one outstanding graduate from the American University of Beirut), the Distinguished Member of Technical Staff award from Bell Labs, three Research Accomplishment Awards from IBM, and the SRC Mahboob-Khan Outstanding Mentor awards from the SRC.


 

Keynote 2:  9:00am ~ 9:45am, Tuesday, July 12, 2016

Lithography-Aware Physical Design

Martin D. F. Wong

 

Professor, Executive Associate Dean, College of Engineering

Department of Electrical and Computer Engineering

University of Illinois at Urbana-Champaign

 

Abstract

 

Lithography continues to be the backbone of circuit fabrication. In advanced IC technology nodes (20nm and beyond), manufacturing (i.e., lithography) has become the bottleneck for the chip design process. Design for manufacturing (DFM) is no longer an option but a necessity. Since physical design determines the locations and geometries of all the transistors and wires, it must understand the down-stream lithography process so that the layout patterns generated are printable on silicon. This is a challenging problem and the requirements oftentimes are non-intuitive to the designers. In this talk, we give an overview of our work on lithography-aware physical design for several leading next-generation lithography (NGL) technologies. The NGL technologies we consider include triple-patterning lithography (TPL), self-aligned double patterning (SADP), directed self-assembly (DSA) and extreme ultraviolet (EUV) lithography.

 

Short Bio

 

Martin D. F. Wong is the Executive Associate Dean of the College of Engineering in the University of Illinois at Urbana-Champaign (UIUC). He is also the Edward C. Jordan Professor of Electrical and Computer Engineering. He received his Ph.D. in computer science from UIUC in 1987. Prof. Wong is internationally known for his research on computer-aided design (CAD) methods for very-large-scale integrated circuits. He has published over 450 technical papers and graduated more than 46 Ph.D. students. He is a Fellow of IEEE.

 


Luncheon Keynote: 1:00pm ~ 1:45pm, Tuesday, July 12, 2016

Advanced Node Layout: Challenges and Opportunities for VLSI Design Automation

Elias Fallon

Engineering Group Director
Virtuoso R&D
Cadence Design Systems, Inc.

 

Abstract:

The introduction of FinFET devices plus multi-patterning technologies on routing layers had led to exciting changes in layout methodologies, especially in custom and analog layout design. While these technologies allow Moore’s Law to continue its march through 16nm/14nm/10nm/7nm, they require drastic changes to how layout is created. The Virtuoso R&D team has been partnering with many leading customers, IP development teams, and semiconductor foundries in the past 5 years to address these challenges. The two factors of design productivity and technology challenges have led to many exciting new capabilities and methodologies for layout designers enabled by Virtuoso.

 

Short Bio:

Elias Fallon has been involved in the automation of analog circuit layout for more than 18 years, starting as one of the original employees of Neolinear, Inc. As one of the primary authors of NeoCell, a product to automate the placement and routing of analog circuits and macros, he co-developed several patented innovations. Since Neolinear’s acquisition by Cadence in 2004, he has managed Virtuoso layout R&D teams focused on Analog Placement, Modgens, and other layout automation tools, as well as continuing innovative development for custom and analog layout methodologies. Beyond his work developing electronic design automation tools, he has led software quality improvement initiatives within Cadence, partnering with the Carnegie Mellon Software Engineering Institute. He is currently the Engineering Group Director leading the R&D teams responsible for the Virtuoso automated placement and routing product lines. Elias graduated from Carnegie Mellon University with an M.S. and B.S. in Electrical and Computer Engineering.

 


Keynote 3:  9:00am ~ 9:45am, Wednesday, July 13, 2016

"Open Innovation, Diving into the deep blue sea of IOT"

Xianfeng (Sean) Ding

Chief Scientist of sensing solution lab

Huawei Technologies Co., Ltd

Abstract:

Huawei is world leading innovator in IOT application, Huawei is pushing forward the integration of sensor, algorithm, and software for new wearable, smart home, smart car application. Motion sensor, vital sign sensor are key technology powering the wearable, which will power the entire mobile health industry, which will come trillion RMB business. Huawei like to share the progress we did so far, and call upon the whole industry to join force to innovate in this area, and completely disrupt the health industry, and enrich human life with better quality and longer life span.

 

Short Bio:

Since Nov 2014, Sean serves as chief scientist for sensing solution lab, and lead the innovation for next generation of internet of things and smart phone in Huawei corporate RD team. Prior Huawei, Sean worked in sensing and control industry 15 years in silicon valley, including STMicro, Bosch sensortec, both are world top 3 sensor companies in the world. Sean also worked for Intel as principal engineer on artificial intelligence, activity recognition, and context awareness. He possesses in depth knowledge in sensing system, including physical design of MEMS and sensor, circuitry, algorithm optimization, system implementation.

 


Luncheon Keynote

12:00pm ~ 12:45pm, Wednesday July 13, 2016

Ballroom A

Smart Campus – A Vision of the Future Intelligent and Connected Buildings

 

 

Charles Shelton

Senior Research Engineer

Bosch Research and Technology Center

 

Summary

The Internet of Things (IoT) promises to have an enormous impact on all aspects of modern life. In particular, buildings, which already have many unconnected sensors and actuators for lighting, climate control, safety and security, will become fully connected networks of sensors, actuators, devices, and computing centers that will manage and coordinate building functions. The goal of this drive towards connectivity is to improve building energy efficiency and optimize maintenance costs, while at the same time optimizing the user experience of the building occupants. We present Smart Campus, a joint research project between Bosch and Carnegie Mellon University for developing a framework and living laboratory for developing intelligent and connected building applications. This talk will explore the potential for future connected building use cases, and some of the work we have already done in deploying fully connected networks of wireless sensors in buildings for environmental monitoring, occupancy sensing, and indoor localization.

 

About Charles Shelton

Charles Shelton is a Senior Research Engineer at the Bosch Research and Technology Center (RTC) in Pittsburgh, PA. He is currently leading the Bosch RTC Smart Campus project. The Smart Campus project focuses on developing IoT platforms and applications for smart infrastructure and intelligent buildings. He has worked on several research projects over the years in the areas of software architecture, distributed systems, and designing graceful degradation and dependability into embedded systems for automotive electronics and building security systems. Most recently he has worked on developing software infrastructures for Internet-connected wireless sensor networks. He earned his PhD in Computer Engineering from Carnegie Mellon University (CMU) in 2003.

 


Panel Discussion

1:00pm ~ 2:00pm, Monday July 11, 2016

Ballroom B

Nanotechnology-inspired Future Computing, Challenges and Opportunities

 

Chair & Moderator

Prof. Yiran Chen - University of Pittsburgh

Dr. Qing Wu – Air Force Research Lab

 Panelists

Dr. Sankar Basu, National Science Foundation

Dr. Jonathan J. Candelaria, Semiconductor Research Corporation

Prof. Dan Hammerstrom, Portland State University

Dr. David Mountain, NSA

Prof. Vijaykrishnan Narayanan, Pennsylvania State University

Dr. Robinson E. Pino, Department of Energy

Dr. Thomas Potok, Oak Ridge National Laboratory

  

Summary

In October 2015, the White House announced a Nanotechnology-Inspired Grand Challenge for Future Computing, which addresses three Administration priorities—the National Nanotechnology Initiative, the National Strategic Computing Initiative (NSCI), and the BRAIN initiative. The goal is to create a new type of computer that can proactively interpret and learn from data, solve unfamiliar problems using what it has learned, and operate with the energy efficiency of the human brain. The theme of the panel discussion is the impact of the Grand Challenge on the research of VLSI design and computing systems and how the academia and government research centers shall respond to it. Panelists from funding agencies, national laboratories, and academic institutes are invited to share their points of view and answer the questions from the conference attendants.

 

 

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